TMS37145

www.ti.com

SCBS879 – MAY 2012

DIGITAL SIGNATURE TRANSPONDER

WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER

Check for Samples: TMS37145

1

FEATURES

•

Low-Frequency (LF) Immobilizer Interface

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Fast Mutual Authentication Within 65 ms

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75-Byte EEPROM

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75-Byte EEPROM

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80-Bit DST80 Security Authentication

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48-Byte Available EEPROM User

Coprocessor

Memory

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Integrated Batteryless Immobilizer Interface

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32-Bit Unique Serial Number

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Half Duplex (HDX) Immobilizer

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High EEPROM Security and Flexibility

Communication Achieves up to 4-in (10-cm)

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Write-Only Authentication Keys

Read Range

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Pages Are Irreversibly Lockable and

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Special Selective Addressing Mode Allows

Protectable

Reliable Learn-In Sequence

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Protected Pages Programmable Only

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80-Bit Authentication Key Length

Through Mutual Authentication

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Up to 8-kbit/s Uplink Data Rate

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Each User Page is Lockable

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5-/3-Byte Challenge/Response Algorithm

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Resonant Frequency: 134.2 kHz

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Fast Authentication Within 42 ms

DESCRIPTION

This new generation of security RFID transponder provides the highest level of security with its integrated 80-bit

encryption algorithm. The 5-byte challenge and 3-byte response algorithm is backward compatible with existing

TI products and provides, together with the burst length coding, short encryption telegram times.

The DST80 offers 65 bytes of free programmable user data stored in nine pages, each of them lockable for

programming. Each of the two 80-bit encryption keys with can be programmed with a single telegram.

The DST80 comes in two versions, preprogrammed with either PWM or PPM communication formats, eliminating

the need for the user to change this field.

COMMUNICATION

ORDERABLE PART NUMBER

FORMAT

PWM

TMS37145TEAIE

-40°C to 85°C

Wedge

PPM

TMS37145TEAIEG

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

WEDGE PACKAGE

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.