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OPA333 Datasheet(PDF) 6 Page - Texas Instruments

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Part # OPA333
Description  0.03-關V/째C Drift, Low-Noise, Rail-to-Rail Output
PDF  26 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA333 Datasheet(HTML) 6 Page - Texas Instruments

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8
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V+
OUTB
-
INB
+INB
OUTA
-
INA
+INA
V
-
A
B
OPA2188
SBOS525B – AUGUST 2011 – REVISED SEPTEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS:
Low-Voltage Operation, VS = ±2 V to < ±4 V (VS = +4 V to < +8 V) (continued)
At TA = +25°C, RL = 10 kΩ connected to VS / 2, and VCOM = VOUT = VS / 2, unless otherwise noted.
OPA2188
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
No load
6
15
mV
Voltage output swing from rail
RL = 10 kΩ
220
250
mV
RL = 10 kΩ, TA = –40°C to +105°C
310
350
mV
ISC
Short-circuit current
±18
mA
RO
Open-loop output resistance
f = 1 MHz, IO = 0
120
Ω
CLOAD
Capacitive load drive
1
nF
POWER SUPPLY
VS
Operating voltage range
4 to 36 (±2 to ±18)
V
VS = ±2 V to VS = ±4 V
385
440
μA
IQ
Quiescent current (per amplifier)
IO = 0 mA, TA = –40°C to +105°C
525
μA
TEMPERATURE RANGE
Specified
–40
+105
°C
Temperature range
Operating
–40
+125
°C
Storage
–65
+150
°C
THERMAL INFORMATION: OPA2188
OPA2188ID
OPA2188IDGK
THERMAL METRIC(1)
D
DGK
UNITS
8 PINS
8 PINS
θJA
Junction-to-ambient thermal resistance
111.0
159.3
θJCtop
Junction-to-case (top) thermal resistance
54.9
37.4
θJB
Junction-to-board thermal resistance
51.7
48.5
°C/W
ψJT
Junction-to-top characterization parameter
9.3
1.2
ψJB
Junction-to-board characterization parameter
51.1
77.1
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
PIN CONFIGURATION
D, DGK PACKAGES
SO-8, MSOP-8
(TOP VIEW)
6
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Links: OPA2188



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