VLMS1500, VLMO1500, VLMY1500, VLMG1500, VLMB1500

www.vishay.com

Vishay Semiconductors

Rev. 1.0, 21-May-12

9

Document Number: 82554

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

PACKAGE DIMENSIONS in millimeters

VLMS1500, VLMO1500, VLMY1500, VLMG1500, VLMB1500

SOLDERING PROFILE

Fig. 19 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020C)

BAR CODE PRODUCT LABEL (example only)

A) 2D barcode

B) Vishay part number

C) Quantity

D) PTC = selection code (binning)

E) Code of manufacturing plant

F) Batch = date code: year/week/plant code

G) Region code

H) SL = sales location

I)

Terminations finishing

K) Lead (Pb)-free symbol

L) Halogen-free symbol

M) RoHS symbol

Recommended solder

pad footprint

Technical drawings

according to DIN

specification

Not indicated tolerances ± 0.2

Drawing-No.: 6.541-5096.01-4

Issue: 1; 20.03.12

0.325

0.6

1.55

1

0.325

Cathode

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

255

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. Ramp Up 3 °C/s

max. Ramp Down 6 °C/s

255 °C

19470-4

IR Reflow Soldering Profile for lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2

max. 2 cycles allowed

A

B

D

C

E

F

G

H

I

M

L

K