1300V 1.0A

EGF1T

1 of 2

Web Site: www.taychipst.com

FEATURES

E-mail: sales@taychipst.com

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

MECHANICAL DATA

Surface Mount Glass Passivated Ultrafast Rectifier

•

Cavity-free glass-passivated junction

•

Ideal for automated placement

•

Ultrafast reverse recovery time

•

Low switching losses, high efficiency

•

Avalanche surge energy capability

•

Meets environmental standard MIL-S-19500

•

Meets MSL level 1, per J-STD-020, LF maximum

peak of 250 °C

•

Solder dip 260 °C, 40 s

•

Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

Case: DO-214BA, molded plastic over glass body

Epoxy meets UL 94V-0 flammability rating

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD22-B102

E3 suffix for consumer grade, meets JESD 201 class

1A whisker test, HE3 suffix for high reliability grade

(AEC Q101 qualified), meets JESD 201 class 2

whisker test

Polarity: Color band denotes cathode end

PARAMETER

SYMBOL

EGF1T

UNIT

Device marking code

ET

Maximum repetitive peak reverse voltage

1300

V

Maximum RMS voltage

910

V

Maximum DC blocking

1300

V

Maximum average forward rectified current

1.0

A

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load

20

A

15

mJ

Operating junction and storage temperature range

- 55 to + 150

°C

Notes:

(1) Pulse test: 300 µs pulse width, 1 % duty cycle

(2) Pulse test: Pulse width

≤ 40 ms

Note:

(1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.95 x 0.95" (24 x 24 mm) copper pad areas

PARAMETER

TEST CONDITIONS

SYMBOL

EGF1T

UNIT

1.0 A

3.0

V

5.0

50

µA

Typical reverse recovery time

75

ns

Typical junction capacitance

4.0 V, 1 MHz

8.0

pF

PARAMETER

SYMBOL

EGF1T

UNIT

50

20

°C/W