LM317L, NCV317LB

http://onsemi.com

2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input-Output Voltage Differential

40

Vdc

Power Dissipation

Case 29 (TO-92)

Thermal Resistance, Junction-to-Ambient

Thermal Resistance, Junction-to-Case

Case 751 (SOIC-8) (Note 1)

Thermal Resistance, Junction-to-Ambient

Thermal Resistance, Junction-to-Case

Internally Limited

160

83

Internally Limited

180

45

W

°C/W

°C/W

W

°C/W

°C/W

Operating Junction Temperature Range

-40 to +150

°C

Storage Temperature Range

-65 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. SOIC-8 Junction-to-Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance

variation versus pad size.

2. This device series contains ESD protection and exceeds the following tests:

Human Body Model, 2000 V per MIL STD 883, Method 3015.

Machine Model Method, 200 V.

18k

6.8V

6.8V

350

300

300

300

3.0k

300

70

200k

2.5

60

50

130

8.67k

500

400

2.4k

12.8k

5.1k

6.3V

2.0k

6.0k

Adjust

180 180

10

p

F

10

p

F

Figure 1. Representative Schematic Diagram