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CUS05 Datasheet(PDF) 4 Page - Toshiba Semiconductor |
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CUS05 Datasheet(HTML) 4 Page - Toshiba Semiconductor |
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4 / 5 page ![]() CUS05 2009-11-11 4 1 100 1000 0.001 1000 1 0.01 0.1 10 100 10 10000 (1) (2) (3) 1.0 0 0 8 20 0.8 0.4 0.2 0.6 120° 60° 180° 300° 240° DC 4 12 16 15 V VR = 20 V 0.01 0 100 1 0.1 10 5 V 3 V 10 V 40 100 140 20 80 120 60 Reverse voltage VR (V) Cj – VR (typ.) Junction temperature Tj (°C) IR – Tj (typ.) Reverse voltage VR (V) PR (AV) – VR (typ.) Pulse test Rectangular waveform α 0° 360° Conduction angle: α Tj = 125°C Time t (s) rth (j-a) – t (1) Device mounted on a ceramic board Soldering land: 2 mm × 2 mm (2) Device mounted on a glass-epoxy board Soldering land: 6 mm × 6 mm (3) Device mounted on a glass-epoxy board Standard Soldering pad 1000 10 1 f = 1 MHz Ta = 25°C 10 100 100 |
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