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CXD2401R Datasheet(PDF) 21 Page - Sony Corporation |
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CXD2401R Datasheet(HTML) 21 Page - Sony Corporation |
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21 / 21 page ![]() – 21 – CXD2401R Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN PLATING 42/COPPER ALLOY PACKAGE STRUCTURE 48PIN LQFP (PLASTIC) 9.0 ± 0.2 ∗ 7.0 ± 0.1 1 12 13 24 25 36 37 48 (0.22) 0.18 – 0.03 + 0.08 0.5 ± 0.08 0.127 – 0.02 + 0.05 0.1 ± 0.1 A 1.5 – 0.1 + 0.2 0° to 10° DETAIL A 0.2g LQFP-48P-L01 LQFP048-P-0707 0.1 SOLDER/PALLADIUM NOTE: Dimension “ ∗” does not include mold protrusion. |
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