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CXG1045N Datasheet(PDF) 5 Page - Sony Corporation |
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CXG1045N Datasheet(HTML) 5 Page - Sony Corporation |
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5 / 5 page  – 5 – CXG1045N Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER / PALLADIUM COPPER ALLOY PACKAGE STRUCTURE SSOP-8P-L01 PLATING SSOP008-P-0044 0.04g 8PIN SSOP (PLASTIC) 0.24 – 0.07 + 0.08 0.65 ∗3.0 ± 0.1 1.25 – 0.1 + 0.2 0.1 A B 0.24 – 0.07 + 0.08 (0.22) 0.1 ± 0.05 0.25 0° to 10° 1 4 5 8 0.13 M DETAIL B A DETAIL NOTE: Dimension “ ∗” does not include mold protrusion. |
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