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CXG1092 Datasheet(PDF) 6 Page - Sony Corporation |
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CXG1092 Datasheet(HTML) 6 Page - Sony Corporation |
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6 / 6 page ![]() – 6 – CXG1092N Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM COPPER ALLOY PACKAGE STRUCTURE PLATING 0.1g SSOP-20P-L03 SSOP020-P-0044 20PIN SSOP(PLASTIC) NOTE: Dimension “ ∗” does not include mold protrusion. A 20 11 10 0.5 1 0.1 M SA A 1.25MAX S B 0° to 10° 0.25 0.1 ± 0.1 DETAIL A ∗5.0 ± 0.05 (0.2) b = 0.22 ± 0.05 DETAIL B : SOLDER b = 0.2 ± 0.03 DETAIL B : PALLADIUM 0.1 S b Sony Corporation |
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