STPS160

Characteristics

Doc ID 4608 Rev 9

5/9

Figure 13.

Thermal resistance junction to ambient versus copper surface under

each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm)

(SMB)

01

2

3

4

5

0

20

40

60

80

100

S(Cu)(cm²)

R

(°C/W)

th(j-a)