STPS340-Y datasheet(4/8 Pages) STMICROELECTRONICS

4 / 8 page

Characteristics

STPS340-Y

4/8

Doc ID 17390 Rev 1

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMB)

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMC)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-a)

δ=tp/T

t (s)

Single pulse

SMB

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-a)

δ=tp/T

t (s)

Single pulse

SMC

Figure 9.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 10.

Junction capacitance versus

reverse voltage applied

(typical values)

I (mA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

j=150°C

j=125°C

j=100°C

j=75°C

j=25°C

V (V)

100

1000

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

Figure 11.

Forward voltage drop versus

forward current

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under each lead

(A)

0.01

0.10

1.00

10.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

j=25°C

(Maximum values)

j=125°C

(Typical values)

j=125°C

(Typical values)

j=125°C

(Maximum values)

(V)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB / SMC

(cm²)

(°C/W)

th(j-a)

Printed circuit board FR4

copper thickness = 35 µm

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