AD20msp415

–7–

REV. 0

MECHANICAL CONSIDERATIONS

The chipset has been specifically designed to meet not only cost

and power consumption requirements but also the physical

dimensions. State-of-the-art package technology was used to

achieve the smallest possible geometries. (See Table II for list of

packaging dimensions and consult individual data sheets of the

two components for further details.)

Table II. Package Dimensions

Parameter

GSMP

VBC

EFR*

Unit

Package

TQFP

TQFP

TQFP

Leads

144

64

64

#

Pitch

0.5

0.5

0.5

mm

Body

20

× 20

10

× 10

10

× 10

mm

2

Total Height

1.6

1.6

1.6

mm

Board Area

22

× 22

12

× 12

12

× 12

mm

2

*The EFR Coprocessor is needed only in systems requiring support of Enhanced

Full Rate Speech Codec.

All components use low profile Plastic Quad Flatpacks with lead

pitches of 0.5 mm, for PCMCIA applications.

ORDERING GUIDE

Part Number

Supply Voltage Range

AD6421AST

+2.7 V to +3.3 V

AD6422AST

+2.7 V to +3.3 V

AD6423

+2.7 V to +3.3 V

An Evaluation and Development system may be ordered for this

chipset, under the part number, NRE20msp415EB1.