HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200915

Issued Date : 2009.08.12

Revised Date :

Page No. : 8/8

H234

HSMC Product Specification

SOT-23-6L (TSOP-6) Dimension

DIM

Min.

Max.

A

2.70

3.12

B

2.60

3.00

C

1.40

1.80

D

0.30

0.55

E

0.00

0.10

F

0°

10°

G

1.80

2.00

H

-

1.30

I

0.10

0.21

J

0.30

0.60

K

0.6*

L

0.95*

M

0.25*

N

1.00

1.20

*: Typical, Unit: mm

SOT-23-6L(TSOP-6) Surface Mounted Package

HSMC Package Code: N

Marking:

Pin Style: 1. Vctrl 2. GND 3. Vout

Material:

• Lead solder plating: Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class:

UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China

Tel: 86-021-58955599 FH: 86-021-58558038