AD7416ARM datasheet(6/20 Pages) AD

6 / 20 page

REV. G

–6–

AD7416/AD7417/AD7418

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C, unless otherwise noted.)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Input Voltage to AGND

AIN1 to AIN4 . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to AGND

. . –0.3 V to VDD + 0.3 V

Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

A Version . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

B Version . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 120

°C/W

Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260

°C

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 100

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

8-Lead SOIC Package, Power Dissipation . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 157

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

MSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 206

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2 If the reference input voltage is likely to exceed V

DD by more than 0.3 V (e.g.,

during power-up) and the reference is capable of supplying 30 mA or more, it is

recommended to use a clamping diode between the REF IN pin and VDD pin. The

diagram below shows how the diode should be connected.

REFIN

VDD

AD7417

BAT81

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD7416/AD7417/AD7418 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

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