REV. D

–12–

AD745

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

16-Lead SOIC (R) Package

SEATING

PLANE

0.0118 (0.30)

0.0040 (0.10)

0.0192 (0.49)

0.0138 (0.35)

0.1043 (2.65)

0.0926 (2.35)

0.050 (1.27)

BSC

16

9

8

1

0.4193 (10.65)

0.3937 (10.00)

0.2992 (7.60)

0.2914 (7.40)

PIN 1

0.4133 (10.50)

0.3977 (10.00)

0.0125 (0.32)

0.0091 (0.23)

8

0

0.0291 (0.74)

0.0098 (0.25)

45

0.0500 (1.27)

0.0157 (0.40)

Figure 40. Optional External Components for Balancing Source Impedances

AD745

OUTPUT

INVERTING

CONNECTION

AD745

OUTPUT

NONINVERTING

CONNECTION

FOR

Revision History

Location

Page

Data Sheet changed from REV. C to REV. D.

Deleted 8-Lead Plastic Mini-DIP (N) and 8-Lead Cerdip (Q) Packages from CONNECTION DIAGRAM . . . . . . . . . . . . . . . . . . 1

Edits to PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Edits to ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Deleted to METALIZATION PHOTOGRAPH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Deleted text from HOW CHIP PACKAGE TYPE AND POWER DISSIPATION AFFECT INPUT BIAS CURRENT . . . . . . . . 9

Deleted 8-Lead Plastic Mini-DIP (N) and 8-Lead Cerdip (Q) Packages from OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . 12