AD7564ARS-B datasheet(6/16 Pages) AD

6 / 16 page

REV. A

AD7564

–6–

ABSOLUTE MAXIMUM RATINGS

(TA = +25°C unless otherwise noted)

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V

IOUT1 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

IOUT2 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V

VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . .± 15 V

Input Current to Any Pin Except Supplies

. . . . . . . .

±10 mA

Operating Temperature Range

Commercial Plastic (A, B Versions). . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

DIP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260

°C

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 900 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . 100

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

1Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2Transient currents of up to 100 mA will not cause SCR latch-up.

PIN CONFIGURATION

DIP, SOIC and SSOP Packages

NC = NO CONNECT

DGND

OUT2 C

OUT2 B

AGND

FBC

REF C

OUT2 D

FB B

REF B

OUT2 A

OUT1 C

OUT1 B

OUT1 D

OUT1 A

FBD

FB A

REF D

REF A

SDOUT

CLR

LDAC

CLKIN

FSIN

SDIN

821

920

TOP VIEW

(Not to Scale)

AD7564

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7564 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Temperature

Linearity

Nominal

Package

Model

Range

Error (LSBs)

Supply Voltage

Option*

AD7564BN

–40

°C to +85°C

±0.5

+5 V

N-28

AD7564BR

–40

°C to +85°C

±0.5

+5 V

R-28

AD7564BRS

–40

°C to +85°C

±0.5

+5 V

RS-28

AD7564AR-B

–40

°C to +85°C

±1

+3.3 V to +5 V

R-28

AD7564ARS-B

–40

°C to +85°C

±1

+3.3 V to +5 V

RS-28

*N = DIP; R = SOIC; RS = SSOP.

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