EVAL-AD7705EB datasheet(5/32 Pages) AD

5 / 32 page

AD7705/AD7706

–5–

REV. A

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V

Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to GND . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Commercial (B Version) . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 105

°C/W

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 139

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

VDD

Temperature

Package

Model

Supply

Range

Description

Options

AD7705BN

2.7 V to 5.25 V

–40

°C to +85°C

Plastic DIP

N-16

AD7705BR

2.7 V to 5.25 V

–40

°C to +85°C

SOIC

R-16

AD7705BRU

2.7 V to 5.25 V

–40

°C to +85°C

TSSOP

RU-16

EVAL-AD7705EB

Evaluation Board

AD7706BN

2.7 V to 5.25 V

–40

°C to +85°C

Plastic DIP

N-16

AD7706BR

2.7 V to 5.25 V

–40

°C to +85°C

SOIC

R-16

AD7706BRU

2.7 V to 5.25 V

–40

°C to +85°C

TSSOP

RU-16

EVAL-AD7706EB

Evaluation Board

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