AOB270AL datasheet(2/6 Pages) AOSMD

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AOT270AL/AOB270AL

Symbol

Min

Typ

Max

Units

BVDSS

VDS=75V, VGS=0V

TJ=55°C

IGSS

±100

VGS(th)

Gate Threshold Voltage

2.2

2.7

3.3

ID(ON)

560

2.15

2.6

TJ=125°C

3.25

TO220

VGS=10V, ID=20A

1.95

2.4

TO263

TJ=125°C

3.0

3.8

VGS=6V, ID=20A

TO263

gFS

VSD

0.66

140

Ciss

10830

Coss

1520

Crss

0.3

0.75

1.2

Ω

147

206

2.55

3.2

Total Gate Charge

VGS=6V, ID=20A

Reverse Transfer Capacitance

VGS=0V, VDS=37.5V, f=1MHz

DYNAMIC PARAMETERS

Gate resistance

VGS=0V, VDS=0V, f=1MHz

3.0

2.35

Ω

Input Capacitance

Output Capacitance

Forward Transconductance

Diode Forward Voltage

VGS=10V, ID=20A

Maximum Body-Diode Continuous Current

TO220

IS=1A,VGS=0V

VDS=5V, ID=20A

Electrical Characteristics (TJ=25°C unless otherwise noted)

STATIC PARAMETERS

Parameter

Conditions

VDS=VGS ID=250µA

VDS=0V, VGS=±20V

Zero Gate Voltage Drain Current

Gate-Body leakage current

RDS(ON)

Static Drain-Source On-Resistance

Drain-Source Breakdown Voltage

On state drain current

ID=250µA, VGS=0V

VGS=10V, VDS=5V

SWITCHING PARAMETERS

IDSS

µA

147

206

Qgs

38.5

Qgd

tD(on)

tD(off)

trr

Qrr

438

THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL

COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING

OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,

FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

Turn-Off Fall Time

Total Gate Charge

VGS=10V, VDS=37.5V, ID=20A

Gate Source Charge

Gate Drain Charge

IF=20A, dI/dt=500A/µs

Turn-On Rise Time

Turn-Off DelayTime

VGS=10V, VDS=37.5V, RL=1.9Ω,

RGEN=3Ω

Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs

Turn-On DelayTime

Body Diode Reverse Recovery Time

A. The value of RθJA is measured with the device mounted on 1in

2 FR-4 board with 2oz. Copper, in a still air environment with T

A =25°C. The

Power dissipation P

DSM is based on R

θJA and the maximum allowed junction temperature of 150°C. The value in any given application

depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.

B. The power dissipation P

D is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper

dissipation limit for cases where additional heatsinking is used.

C. Repetitive rating, pulse width limited by junction temperature T

J(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep

initial T

J =25°C.

D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.

E. The static characteristics in Figures 1 to 6 are obtained using <300

µs pulses, duty cycle 0.5% max.

F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,

assuming a maximum junction temperature of T

J(MAX)=175°C. The SOA curve provides a single pulse rating.

G. The maximum current limited by package is 140A.

H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with T

A=25°C.

Rev 0 : Dec. 2012

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