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AD845 Datasheet(PDF) 3 Page - Analog Devices

Part # AD845
Description  Precision, 16 MHz CBFET Op Amp
PDF  8 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD845 Datasheet(HTML) 3 Page - Analog Devices

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AD845
REV. D
–3–
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option*
AD845JN
0
°C to +70°C
8-Pin Plastic Mini-DIP
N-8
AD845KN
0
°C to +70°C
8-Pin Plastic Mini-DIP
N-8
AD845JR-16
0
°C to +70°C
16-Pin SOIC
R-16
AD845AQ
–40
°C to +85°C
8-Pin Cerdip
Q-8
AD845BQ
–40
°C to +85°C
8-Pin Cerdip
Q-8
AD845SQ
–55
°C to +125°C
8-Pin Cerdip
Q-8
AD845SQ/883B
–55
°C to +125°C
8-Pin Cerdip
Q-8
5962-8964501PA
–55
°C to +125°C
8-Pin Cerdip
Q-8
AD845JCHIPS
0
°C to +70°C
Die
AD845SCHIPS
–55
°C to +125°C
Die
AD845JR-16-REEL
0
°C to +70°C
Tape & Reel
AD845JR-16-REEL7
0
°C to +70°C
Tape & Reel
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Internal Power Dissipation
2
Plastic Mini-DIP . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Watts
Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Watts
16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Watts
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . + VS
Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Differential Input Voltage . . . . . . . . . . . . . . . . . . +VS and –VS
Storage Temperature Range
Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65
°C to +150°C
N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65
°C to +125°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300
°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability .
2Mini-DIP package:
θ
JA = 100°C/watt; cerdip package: θJA = 110°C/watt. SOIC
package:
θ
JA = 100°C/W.
METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Contact factory for latest dimensions.
SUBSTRATE CONNECTED TO +V
S



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