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AON2809 Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors |
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AON2809 Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 5 page ![]() AON2809 Symbol Min Typ Max Units BVDSS -12 V VDS=-12V, VGS=0V -1 TJ=55°C -5 IGSS ±10 µA VGS(th) Gate Threshold Voltage -0.3 -0.6 -0.9 V ID(ON) -8 A 55 68 TJ=125°C 72 89 70 90 m Ω 90 118 m Ω gFS 8 S VSD -0.7 -1 V IS -1.5 A Ciss 415 pF Coss 115 pF Crss 78 pF Rg 26 Ω Qg(4.5) 4.4 nC Qgs 0.8 nC Qgd 0.9 nC tD(on) 11.8 ns t 24.5 ns Drain-Source Breakdown Voltage On state drain current ID=-250µA, VGS=0V VGS=-4.5V, VDS=-5V VGS=-4.5V, ID=-2A Forward Transconductance Diode Forward Voltage SWITCHING PARAMETERS IS=-1A,VGS=0V VDS=-5V, ID=-2A Gate resistance VGS=0V, VDS=0V, f=1MHz Reverse Transfer Capacitance VGS=0V, VDS=-6V, f=1MHz Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions RDS(ON) Static Drain-Source On-Resistance IDSS µA VDS=VGS, ID=-250µA VDS=0V, VGS= ±6V Zero Gate Voltage Drain Current Gate-Body leakage current m Ω VGS=-1.8V, ID=-1A VGS=-2.5V, ID=-1A Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS Turn-On Rise Time V =-4.5V, V =-6V, R =3 Ω, VGS=-4.5V, VDS=-6V, ID=-2A Gate Source Charge Gate Drain Charge Total Gate Charge tr 24.5 ns tD(off) 54.5 ns tf 37.3 ns trr 21 ns Qrr 5 nC THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=-2A, dI/dt=100A/µs Turn-On Rise Time Turn-Off DelayTime VGS=-4.5V, VDS=-6V, RL=3Ω, RGEN=3Ω Turn-Off Fall Time IF=-2A, dI/dt=100A/µs A. The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on R θJA t ≤ 10s and the maxminum maximum allowed junction temperature of 150°C. C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialT J=25°C. D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating. G. The maximum current rating is package limited. Rev0: Nov. 2012 www.aosmd.com Page 2 of 5 |
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