ADG736

–4–

REV. 0

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG736 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

µSOIC Package, Power Dissipation . . . . . . . . . . . . . . . 315 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability. Only one absolute maxi-

mum rating may be applied at any one time.

limited to the maximum ratings given.

ORDERING GUIDE

Temperature

Package

Model

Range

Brand

1

Option

2

ADG736BRM

–40

°C to +85°C

SAB

RM-10

NOTES

number.

µSOIC.

PIN CONFIGURATION

(10-Lead

SOIC)

10

9

8

7

6

1

2

3

4

5

IN1

S1A

GND

S2A

IN2

D1

S1B

S2B

D2

TOP VIEW

(Not to Scale)

ADG736

TERMINOLOGY

Most positive power supply potential.

GND

Ground (0 V) reference.

S

Source terminal. May be an input or output.

D

Drain terminal. May be an input or output.

IN

Logic control input.

Ohmic resistance between D and S.

∆R

ON

On resistance match between any two chan-

Flatness is defined as the difference between

the maximum and minimum value of on resis-

tance as measured over the specified analog

signal range.

Source leakage current with the switch “OFF.”

Channel leakage current with the switch “ON.”

Analog voltage on terminals D, S.

“OFF” switch source capacitance.

“ON” switch capacitance.

Delay between applying the digital control

input and the output switching on. See Test

Circuit 4.

Delay between applying the digital control

input and the output switching off.

“OFF” time or “ON” time measured between

the 90% points of both switches, when switch-

ing from one address state to another. See

Test Circuit 5.

Crosstalk

A measure of unwanted signal that is coupled

through from one channel to another as a

result of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling

through an “OFF” switch.

Bandwidth

The frequency at which the output is attenu-

ated by –3 dBs.

On Response

The frequency response of the “ON” switch.

On Loss

The voltage drop across the “ON” switch,

seen on the On Response versus frequency

plot as how many dBs the signal is away from

0 dB at very low frequencies.

Table I. Truth Table

Logic

Switch A

Switch B

0

OFF

ON

1

ON

OFF