REV. 0

–3–

ADM1032

P

S

PS

SCLK

SDATA

Figure 1. Diagram for Serial Bus Timing

ORDERING GUIDE

Temperature

Package

Package

Branding

SMBus

Model

Range

Description

Option

Information

Addr

ADM1032AR

0

°C to 120°C

8-Lead SO Package

SO-8

1032AR

4C

ADM1032ARM

0

°C to 120°C

8-Lead Micro_SO Package

RM-8

T2A

4C

PIN CONFIGURATION

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

D+

SCLK

D–

THERM

ADM1032

GND

ALERT

SDATA

PIN FUNCTION DESCRIPTIONS

Pin

No.

Mnemonic

Description

Positive Supply, 3 V to 5.5 V.

2

D+

Positive Connection to Remote Temperature Sensor.

3

D–

Negative Connection to Remote Temperature Sensor.

4

THERM

Open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event of an over-

5

GND

Supply Ground Connection

6

ALERT

Open-Drain Logic Output Used as Interrupt or SMBus Alert.

7

SDATA

Logic Input/Output, SMBus Serial Data. Open-Drain Output. Requires pull-up resistor.

8

SCLK

Logic Input, SMBus Serial Clock. Requires pull-up resistor.

ABSOLUTE MAXIMUM RATINGS

*

D– to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.6 V

SCLK, SDATA,

ALERT . . . . . . . . . . . . . . . . –0.3 V to +5.5 V

THERM . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V

Input Current, SDATA,

THERM . . . . . . . . . . . –1, +50 mA

Input Current, D– . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±1 mA

ESD Rating, All Pins (Human Body Model) . . . . . . >1000 V

°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

IR Reflow Peak Temp . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

Lead Temp (Soldering 10 sec) . . . . . . . . . . . . . . . . . . . 300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause

permanent damage to the device. This is a stress rating only; functional operation

of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

THERMAL CHARACTERISTICS

8-Lead SO Package

8-Lead Micro_SO Package