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AON7902 Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors |
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AON7902 Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 11 page ![]() AON7902 Symbol Min Typ Max Units BVDSS 30 V VDS=30V, VGS=0V 1 TJ=55°C 5 IGSS 100 nA VGS(th) Gate Threshold Voltage 1.3 1.8 2.3 V ID(ON) 90 A 17 21 TJ=125°C 24 29 22 28 m Ω gFS 33 S VSD 0.7 V IS 20 A Ciss 470 590 710 pF Coss 250 360 470 pF Crss 13 23 40 pF Rg 0.7 1.5 2.3 Ω Qg(10V) 7 9 11.0 nC Qg(4.5V) 3 4 5.0 nC Qgs 1.5 nC Qgd 1.5 nC tD(on) 6 ns tr 3 ns tD(off) 18 ns tf 3 ns trr 8 11 14 ns Qrr 15 19 23 nC COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Body Diode Reverse Recovery Charge IF=8A, dI/dt=500A/µs Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS Turn-On Rise Time Turn-Off DelayTime VGS=10V, VDS=15V, RL=1.8Ω, RGEN=3Ω Gate resistance VGS=0V, VDS=0V, f=1MHz Reverse Transfer Capacitance Turn-Off Fall Time Total Gate Charge VGS=10V, VDS=15V, ID=8A Gate Source Charge Gate Drain Charge Total Gate Charge On state drain current IS=1A,VGS=0V VDS=5V, ID=8A VGS=4.5V, ID=4A Forward Transconductance Diode Forward Voltage VGS=10V, VDS=5V VGS=10V, ID=8A RDS(ON) Static Drain-Source On-Resistance IDSS µA VDS=VGS ID=250µA VDS=0V, VGS= ±20V Zero Gate Voltage Drain Current Gate-Body leakage current m Ω IF=8A, dI/dt=500A/µs VGS=0V, VDS=15V, f=1MHz SWITCHING PARAMETERS Q1 Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions Body Diode Reverse Recovery Time Drain-Source Breakdown Voltage ID=250µA, VGS=0V A. The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The Power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g. G. The maximum current rating is limited by package. H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. Rev 0: Jan 2011 www.aosmd.com Page 2 of 11 |
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