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ADP1148 Datasheet(PDF) 9 Page - Analog Devices |
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ADP1148 Datasheet(HTML) 9 Page - Analog Devices |
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9 / 16 page ![]() ADP1148, ADP1148-3.3, ADP1148-5 –9– REV. A An additional 0.1 µF – 1 µF ceramic bypass capacitor is advised on VIN Pin 3 parallel with CIN. The selection of COUT is driven by the required effective series resistance (ESR). The ESR of COUT must be less than twice the value of RSENSE for proper operation of the ADP1148: COUT required ESR < 2 RSENSE. Optimum efficiency is obtained by making the ESR equal to RSENSE. As the ESR is increased up to 2 RSENSE, the efficiency degrades by less than 1%. Manufacturers such as Sprague, and United Chemmicon should be considered for high performance capacitors. The OS-CON semiconductor dielectric capacitor has the lowest ESR for its size, at a somewhat higher price. Once the ESR requirement for COUT has been met, the RMS current rating generally far ex- ceeds the IRIPPLE(P-P) requirement. In surface-mount applications multiple capacitors may have to be paralleled to meet the capacitance, ESR, or RMS current handling requirements of the application. Aluminum electrolytic and dry tantalum capacitors are both available in surface-mount configurations. In the case of tantalum, it is critical that the capacitors are surge tested for use in switching power supplies. Consult the manufacturer for other specific recommendations. The CO output filter capacitor has to be sized correctly to avoid excessive ripple voltages at low frequencies. See Figure 5 for output capacitor selection. Transient Response The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in dc (resistive) load current. When a load step occurs, VOUT shifts by an amount equal to D1LOAD × ESR , where ESR is the effective series resistance of COUT. D1LOAD also begins to charge or discharge COUT until the regulator loop adapts to the current change and returns VOUT to its steady- state value. During this recovery time VOUT can be monitored for overshoot or ringing which would indicate a stability prob- lem. The external components on the ITH pin shown in the Figure 1 circuit will prove adequate compensation for most applications. A second, more severe transient is caused by switching in loads with large (>1 mF) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, caus- ing a rapid drop in VOUT. No regulator can deliver enough cur- rent to prevent this problem if the load switch resistance is low and it is driven quickly. The only solution is to limit the inrush current to these capacitors below the current limit of the circuit. Efficiency The percent efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most im- provement. Percent efficiency can be expressed as: % Efficiency = 100% - (L1 + L2 + L3 +. . . ) where L1, L2, etc. are the individual losses as a percentage of input power. (For high efficiency circuits only small errors are incurred by expressing losses as a percentage of output power.) Although all dissipative elements in the circuit produce losses, three main sources usually account for most of the losses in ADP1148 circuits: 1) ADP1148 dc bias current, 2) MOSFET gate charge currents, 3) I 2 × R losses. 1) The dc supply current is the current which flows into VIN Pin 3 less the gate charge current. For VIN = 10 V the ADP1148 dc supply current is 160 µA for no load, and increases pro- portionally with load up to a constant 1.6 mA after the ADP1148 has entered continuous mode. Because the dc bias current is drawn from VIN, the resulting loss increases with input voltage. For VIN = 10 V the dc bias losses are generally less than 1% for load currents over 30 mA. However, at very low load currents the dc bias current accounts for nearly all of the loss. 2) MOSFET gate charge currents result from switching the gate capacitance of the power MOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from VIN to ground. The resulting dQ/dt is a current out of VIN which is typically much larger than the dc supply current. In continuous mode, IGATECHG = f (QP + QN). The typical gate charge for a 100 m Ω N-channel power MOSFET is 25 nC and for the P-channel about twice that value. This results in IGATECHG = 7.5 mA in 100 kHz continu- ous operation for a 2% to 3% typical midcurrent loss with VIN = 10 V. Note that the gate charge loss increases directly with both input voltage and operating frequency. This is the principal reason why the highest efficiency circuits operate at moderate frequencies. Furthermore, it argues against using a larger MOSFET than necessary to control I 2 × R losses. 3) I 2 × R losses are easily predicted from the dc resistances of the MOSFET, inductor, and current shunt. In continuous mode the average output current flows through L and RSENSE, but is “chopped” between the P-channel and N- channel MOSFETs. If the two MOSFETs have about the same RDS(ON), the resistance of one MOSFET can be simply summed with the resistances of L and RSENSE to obtain I 2 × R losses. For example, if each RDS(ON) = 100 m Ω, R L = 150 m Ω, and RSENSE = 50 m Ω, then the total resistance is 300 mΩ. This results in losses ranging from 3% to 10% as the output current increases from 0.5 A to 2 A. I 2 × R losses cause the efficiency to roll-off at high output currents. Figure 6 shows how the efficiency losses in a typical ADP1148 regulator. The gate charge loss is responsible for the majority of the efficiency lost in the midcurrent region. If power saving mode operation was not employed at low currents, the gate charge loss alone would cause the efficiency to drop to unac- ceptable levels. With power saving mode operation, the dc supply current represents the lone (and unavoidable) loss component which continues to become a higher percentage as output cur- rent is reduced. As expected, the I 2 × R losses dominate at high load currents. Other losses including CIN and COUT ESR dissi- pative losses, MOSFET switching losses, Schottky conduction losses during deadtime and inductor core losses, generally account for less than 2% total additional loss. |
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