ISO7640FC datasheet(18/31 Pages) TI

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100

200

300

400

500

600

700

100

150

200

Case Temperature - C

= V

= 5.5V

CC1

CC2

= V

= 2.7V

CC1

CC2

= V

= 3.6V

CC1

CC2

ISO7631FM, ISO7631FC

ISO7640FC, ISO7641FC

SLLSEC3A – SEPTEMBER 2012 – REVISED SEPTEMBER 2012

www.ti.com

Table 3. IEC 60664-1 RATINGS TABLE

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic Isolation Group

Material Group

Rated mains voltage

≤ 300 VRMS

I–IV

Installation classification

Rated mains voltage

≤ 600 VRMS

I–III

Rated mains voltage

≤ 1000 VRMS

I–II

REGULATORY INFORMATION

VDE

CSA

Certified according to DIN EN 60747-5-2

Approved under CSA Component

Recognized under 1577 Component Recognition

Acceptance Notice #5A

Program

Basic Insulation

Maximum Transient Overvoltage, 4000

4000 VPK Insulation

Single Protection, 2500 VRMS

(1)

VPK

Maximum Working Voltage, 1414 VPK

File Number: 40016131

File Number: 220991

File Number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL 1577.

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θJA = 72 °C/W, VI = 5.5V, TJ = 150°C, TA = 25°C

316

Safety input, output, or supply

DW-16

θJA = 72 °C/W, VI = 3.6V, TJ = 150°C, TA = 25°C

482

current

θJA = 72 °C/W, VI = 2.7V, TJ = 150°C, TA = 25°C

643

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

Figure 5. DW-16

θJC Thermal Derating Curve per IEC 60747-5-2

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