TPS51313

SLUSB31 – SEPTEMBER 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

OUTPUT

MINIMUM

ORDERABLE

PACKAGE

PINS

ECO PLAN

DEVICE NUMBER

SUPPLY

QUANTITY

TPS51313DRCR

Tape and reel

3000

Green (RoHS and

–10°C to 85°C

Plastic SON (DRC)

10

no Pb/Br)

TPS51313DRCT

Mini reel

250

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

VIN, VCC

–0.3

6.0

SW

–2.0

6.0

SW (transient 20nsec)

-3.0

8.5

V

EN

–0.3

6.0

FB

–1

3.6

PGOOD

–0.3

6.0

V

125

°C

–55

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted.

THERMAL INFORMATION

TPS51313

UNITS

DRC (10-PIN)

Junction-to-ambient thermal resistance

42.4

Junction-to-case (top) thermal resistance

53.9

Junction-to-board thermal resistance

18.1

°C/W

Junction-to-top characterization parameter

1.1

Junction-to-board characterization parameter

18.3

Junction-to-case (bottom) thermal resistance

6.3

spacer - so note to thermal table has space between the note and ROC table title

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

VIN, VCC

–0.1

5.5

SW

–0.1

5.5

Input voltage range

V

EN

–0.1

5.5

FB

–0.1

3.5

Output voltage range

PGOOD

–0.1

5.5

V

–10

85

°C

2

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