UCC27532

SLUSBD9 – FEBRUARY 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

OPERATING

PEAK CURRENT

INPUT THRESHOLD

PART NUMBER

TEMPERATURE RANGE

(SOURCE AND SINK)

LOGIC

CMOS-(dependent on

UCC27532DBV

SOT-23, 6-PIN

2.5 A and 5 A

-40°C to +140°C

VDD bias voltage)

(1)

DBV package uses Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to

be compatible with either lead free or Sn/Pb soldering operations.

(2)

For the most up-to-date packaging information see the TI web site.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage range,

VDD

-0.3

35

Continuous

OUTH, OUTL

-0.3

VDD +0.3

V

Pulse

OUTH, OUTL (200 ns)

-2

VDD +0.3

Continuous IN, EN

-5

27

Pulse IN, EN (1.5 µs)

-6.5

27

V

Human body model, HBM (ESD)(5)

4000

Charged device model, CDM (ESD)

1000

-40

150

-65

150

°C

Soldering, 10 sec.

300

Lead temperature

Reflow

260

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See

Packaging Section of the datasheet for thermal limitations and considerations of packages.

(3)

These devices are sensitive to electrostatic discharge; follow proper device handling procedures.

2

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: UCC27532