SSM2211

REV. 0

–14–

square cm of copper area to the ground pins. It is recommended

that the solder mask and/or silk screen on the PCB traces adja-

cent to the SSM2211 pins be deleted, thus reducing further the

junction to ambient thermal resistance of the package.

COPPER PADDLE

1

2

3

4

8

7

6

5

COPPER

LEAD-FRAME

Figure 49. Thermal Coastline