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TMP12 Datasheet(PDF) 5 Page - Analog Devices

Part # TMP12
Description  Airflow and Temperature Sensor
PDF  14 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

TMP12 Datasheet(HTML) 5 Page - Analog Devices

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TMP12
REV. 0
–5–
HEATER RESISTOR POWER DISSIPATION – mW
35
30
0
0
50
100
150
200
20
15
10
5
25
AIR FLOW RATES
V
=
5V
SO–8 SOLDERED TO .5 "
.3" Cu PCB
250
a. 0 FPM
c. 450 FPM
b. 250 FPM
d. 600 FPM
a
b
c
d
Figure 1. SOIC Junction Temperature Rise vs. Heater
Dissipation
HEATER RESISTOR POWER DISSIPATION – mW
25
20
0
0
250
50
100
150
200
15
10
5
AIR FLOW RATES
V
=
5V
PDIP SOLDERED TO 2"
1.31" Cu PCB
a. 0 FPM
c. 450 FPM
b. 250 FPM
d. 600 FPM
a
b
c
d
Figure 2. PDIP Junction Temperature Rise vs. Heater
Dissipation
TIME – sec
25
20
0
15
10
5
30
35
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90 100 110 120 130
V
=
5V RHEATER TO EXTERNAL
SUPPLY TURNED ON @ t = 5 sec
SO–8 SOLDERED TO .5"
.3" COPPER PCB
PDIP SOLDERED TO 2"
1.31 COPPER PCB
a. SO–8, HTR @ 5V
b. PDIP, HTR @ 5V
c. SO–8, HTR @ 3V
d. PDIP, HTR @ 3V
a
b
c
d
Figure 3. Junction Temperature Rise in Still Air
TRANSITION FROM
100
°C STIRRED
BATH TO FORCED
25
°C AIR
V
=
5V, NO LOAD, HEATER OFF
SO–8 SOLDERED TO .5"
.3" Cu PCB
PDIP SOLDERED TO 2"
1.31" Cu PCB
AIR VELOCITY – FPM
140
0
0
700
100
200
300
400
500
600
120
80
60
40
20
100
a. PDIP
PCB
b. SOIC
PCB
a
b
Figure 4. Package Thermal Time Constant in Forced Air
TIME – sec
80
30
0
02
46
8
10
12
14
16
18
20
70
40
20
10
60
50
90
100
110
120
V
=
5V, NO LOAD, HEATER OFF
SO–8 SOLDERED TO .5"
.3" Cu PCB
PDIP SOLDERED TO 2"
1.31" Cu PCB
a. SO–8
PCB
b. PDIP
PCB
a
b
TRANSITION FROM STILL
25
°C
AIR TO STIRRED
100
°C BATH
Figure 5. Thermal Response Time in Stirred Oil Bath
TEMPERATURE –
°C
102
99.5
98
-75
-25
25
75
125
175
101.5
100
99
98.5
101
100.5
V+ = +5V
Figure 6. Heater Resistance vs. Temperature



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