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SPW08F0D Datasheet(PDF) 14 Page - Seoul Semiconductor

Part # SPW08F0D
Description  Industry Standard SMT package Low thermal resistance
PDF  16 Pages
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Manufacturer  SEOUL [Seoul Semiconductor]
Direct Link  http://www.seoulsemicon.com
Logo SEOUL - Seoul Semiconductor

SPW08F0D Datasheet(HTML) 14 Page - Seoul Semiconductor

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Rev. 0.00
Rev. 0.00
DECEMBER. 2010.
DECEMBER. 2010.
www.Acriche.com
www.Acriche.com
서식번호 : SSC- QP- 7- 07- 24 (Rev.00)
11. Soldering
10 sec. Max.
Soldering time
Condition
240
℃
℃
℃
℃ Max.
Peak-Temperature
120 sec. Max.
Pre-heat time
120~150
℃
℃
℃
℃
Pre-heat
Lead Solder
10 sec. Max.
Soldering time Condition
260
℃
℃
℃
℃ Max.
Peak-Temperature
120 sec. Max.
Pre-heat time
150~200
℃
℃
℃
℃
Pre-heat
Lead Free Solder
Lead Solder
2.5~5 C / sec.
o
o
o
Pre-heating
120~150 C
120sec. Max.
60sec. Max.
Above 200 C
o
240 C Max.
10 sec. Max.
2.5~5 C / sec.
(1) Lead Solder
(2) Lead-Free Solder
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Lead-free Solder
1~5 C / sec.
o
o
o
o
1~5 C / sec.
Pre-heating
150~200
C
120sec. Max.
60sec. Max.
Above 220 C
o
260 C Max.
10 sec. Max.



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