D372-Type Digital Uncooled DFB

Data Sheet

Laser Module for 2.5 Gbits/s Applications

December 2000

2

2

Agere Systems Inc.

The device characteristics listed in this document are

met at 2.0 mW output power. Higher- or lower-power

operation is possible. Under conditions of a fixed

photodiode current, the change in optical output is typi-

cally

±0.5 dB over an operating temperature range of

–40

°C to +85 °C.

This device incorporates the new laser 2000 manufac-

turing process from the Optoelectronic Products unit of

Agere Systems Inc.. Laser 2000 is a low-cost platform

that targets high-volume manufacturing and tighter

product distributions on all optical subassemblies. This

platform incorporates an advanced optical design that

is produced on one of the highly automated production

lines at the Opotelectronic manufacturing facility. The

laser 2000 platform is qualified for the central office and

uncontrolled environments, and can be used for appli-

cations requiring high performance and low cost.

Table 1. Pin Descriptions

Pin Number

Connection

1

Thermistor

2

Thermistor, package GND

3

Laser dc bias cathode (–) choke

4

Photodiode cathode

5

Photodiode anode

6

Laser diode anode (+)

7

Laser RF input cathode (–) 25

Ω

8

Laser diode anode (+)

Figure 1. D372-Type Digital Uncooled DFB Mini 8-Pin Laser Module Schematic, Top View

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

* Rating varies with temperature.

Parameter

Symbol

Min

Max

Unit

Maximum Peak Laser Drive Current or

Maximum Fiber Power*

—

—

150

10

mA

mW

Peak Reverse Laser Voltage:

Laser

Monitor

—

—

2

20

V

V

Monitor Forward Current

—2

mA

Operating Case Temperature Range

–40

85

°C

Storage Case Temperature Range

–40

85

°C

Lead Soldering Temperature/Time

—

—

260/10

°C/s

Relative Humidity (noncondensing)

RH

—

85

%

1-900.b

56

8

7

43

1

2