D572-Type 1.5

µm Uncooled DFB FastLight Laser Module

Advance Data Sheet

for 2.5 Gbits/s and High-Bandwidth Applications

February 2000

2

2

Lucent Technologies Inc.

The device characteristics listed in this document are

met at 2.0 mW output power. Higher- or lower-power

operation is possible. Under conditions of a fixed

photodiode current, the change in optical output is typi-

cally

±0.5 dB over an operating temperature range of

–25

°C to +70 °C.

This device incorporates the new Laser 2000 manufac-

turing process from the Optoelectronic Products unit of

Lucent Technologies Microelectronics Group. Laser

2000 is a low-cost platform that targets high-volume

manufacturing and tighter product distributions on all

optical subassemblies. This platform incorporates an

advanced optical design that is produced on one of the

highly automated production lines at the Opotelectronic

manufacturing facility. The Laser 2000 platform is quali-

fied for the central office and uncontrolled environ-

ments, and can be used for applications requiring high

performance and low cost.

Table 1. Pin Descriptions

Pin Number

Connection

1

Thermistor

2

Thermistor, package GND

3

Laser dc bias cathode (–) choke

4

Photodiode cathode

5

Photodiode anode

6

Laser diode anode (+)

7

Laser RF input cathode (–) 25

Ω

8

Laser diode anode (+)

Figure 1. D572-Type Uncooled DFB Mini 8-Pin Laser Module Schematic, Top View

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

* Rating varies with temperature.

Parameter

Symbol

Min

Max

Unit

Maximum Peak Laser Drive Current or

Maximum Fiber Power*

—

—

150

10

mA

mW

Peak Reverse Laser Voltage:

Laser

Monitor

—

—

2

20

V

V

Monitor Forward Current

—2

mA

Operating Case Temperature Range

–40

85

°C

Storage Case Temperature Range

–40

85

°C

Lead Soldering Temperature/Time

—

—

260/10

°C/s

Relative Humidity (noncondensing)

RH

—

85

%

1-900.b

56

8

7

43

1

2