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SSWM81EB0 Datasheet(PDF) 17 Page - Seoul Semiconductor |
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SSWM81EB0 Datasheet(HTML) 17 Page - Seoul Semiconductor |
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17 / 18 page ![]() APCPCWM_4828539:WP_0000001WP_0000001 Rev. 00 Rev. 00 October, 2012 October, 2012 www.acrich.com www.acrich.com Document No. : QP-7-07-18 (Rev.00) 공통_을 [17 /18] [17 /18] 10. Soldering (3) Hand Soldering conditions Not more than 3 seconds @MAX 350C, under Soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead Free Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. |
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