ADP2386ACPZN-R7 datasheet(23/24 Pages) AD

23 / 24 page

Data Sheet

ADP2386

Rev. A | Page 23 of 24

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.20

0.15

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD .

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

0.20 MIN

0.20

MIN

0.20

MIN

0.20

MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.80

2.70

2.60

1.05

0.95

0.85

0.45

0.35

0.25

1.50

1.40

1.30

EXPOSED

PAD

EXPOSED

PAD

Figure 40. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-24-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP2386ACPZN-R7

−40°C to +125°C

24-Lead LFCSP_WQ, 7”Tape and Reel

CP-24-12

ADP2386-EVALZ

Evaluation Board

ADP2386BB-EVALZ

Inverting Buck-Boost Evaluation Board

Z = RoHS Compliant Part.

ADP2386ACPZN-R7 Datasheet(PDF) 23 Page - Analog Devices

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