340

Revised: July 9, 2008

©2008 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Standard Bidirectional DIAC Trigger

HTxxx & HTMxxx & STxxx Series

Figure 6: Circuit Used to Measure DIAC

Characteristics (Refer to Figure 4)

Figure 7: Peak Output Current vs.Triggering

Capacitance (Per Figure 5 with R

120 V rms

60 Hz

47 k

D.U.T.

R

L

20

1%

V

C

100 k

*

C

T

I

L

0.1 μF

Triggering Capacitance (C

0

50

100

150

200

250

300

.01

.02

.03

.04

.05

.06

.07

.08

.09

.10

Typical

(35

V Device)

Soldering Parameters

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 190 secs

Average ramp up rate (LiquidusTemp

(T

5°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Time (min to max) (t

60 – 150 seconds

PeakTemperature (T

260 °C

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

280°C

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do