Technical Note

20/24

BA10393F,BA10339F,BA10339FV,BA2903SF,BA2903SFV,BA2903SFVM,BA2903F,BA2903FV,

BA2903FVM,BA2901SF,BA2901SFV,BA2901SKN,BA2901F,BA2901FV,BA2901KN,BA8391G

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2011.08 - Rev.B

© 2011 ROHM Co., Ltd. All rights reserved.

●Notes for use

1) Unused circuits

When there are unused circuits it is recommended that they be connected as in Fig.116, setting the non-inverting input

terminal to a potential within the in-phase input voltage range (VICR).

Fig.116 Disable circuit example

2) Input terminal voltage

(BA8391 / BA2903 / BA2901 family)Applying VEE + 36V to the input terminal is possible without causing deterioration of

the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit

operation. Please note that the circuit operates normally only when the input voltage is within the common mode input

voltage range of the electric characteristics.

3) Power supply (signal / dual)

The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the signal supply op-amp

can be used as a dual supply op-amp as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in

chip temperature, including reduced current capability.

Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a

sufficient margin in thermal design. Refer to the thermal derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and

the power supply, or the output and GND may result in IC destruction.

6) Terminal short-circuits

When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation

and, subsequently, destruction.

7) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

8) Radiation

This IC is not designed to withstand radiation.

9) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezoelectric (piezo) effects.

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC.

Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the

jig during the inspection phase, ensure that the power is turned off before inspection and removal.

Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage.

Please keep this

potential in Vicm

VCC

VEE

－

＋

OPEN