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Revision: 14-Mar-12

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Document Number: 28362

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Table 2

TEST PROCEDURES AND REQUIREMENTS for standard and vertical miniaturized series (5.5 V; 70 °C)

NAME OF TEST

IEC 60384-4/

EN130300

SUBCLAUSE

PROCEDURE

(quick reference)

REQUIREMENTS

Robustness of

terminations

4.4

Tensile strength; application of loading force for 10 s:

No breaks

20 N (standard series)

5 N (vertical miniaturized series)

Resistance to

soldering heat

4.5

Solder bath; 260 °C; 5 s

C/C: ± 10 %

Solderability

4.6

Solder bath; 235 °C; 2 s

 75 % tinning

Vibration

4.8

10 Hz to 55 Hz; 1.5 mm; 3 directions;

2 h per direction

C/C: ± 10 %

Damp heat,

steady state

4.12

500 h at 55 °C; RH 90 % to 95 %;

no voltage applied

C/C: ± 30 %

Endurance

4.13

1000 h

C/C: ± 30 %

Storage at upper

category temperature

4.17

no voltage applied;

1000 h

C/C: ± 30 %

Self discharge

-

24 h storage at room temperature after application

of 5V for 1h

Remaining voltage:

 4V

Characteristics at high

and low temperature

4.19

Step 1: reference measurement

Step 2: measurement at - 25 °C

Step 3: measurement at + 20 °C

Step 4: measurement at + 70 °C

Step 5: measurement at + 20 °C

C/C: ± 30 % of + 20 °C value