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Vishay Roederstein

Revision: 18-Oct-12

4

Document Number: 25018

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

REFLOW SOLDERING CONDITIONS FOR SMD ALUMINUM ELECTROLYTIC CAPACITORS

PROFILE FEATURE

SOLDERING CONDITION

Ø 4 TO Ø 10

Ø 12.5

Ø 16

3 °C/s max.

3 °C/s max.

Preheat

150 °C

150 °C

200 °C

200 °C

60 s to 150 s

40 s to 120 s

40 s to 100 s

Ramp-up rate

3 °C/s max.

3 °C/s max.

Time maintained above

217 °C

217 °C

60 s to 90 s

40 s to 60 s

250 °C

240 °C

230 °C

10 s max.

10 s max.

Ramp-down rate

3 °C/s max.

3 °C/s max.

Time 25 °C to peak temperature

8 min max.

8 min max.

RESISTANCE TO SOLDERING HEAT

Leakage current

Less than specified value

Capacitance value

Within ± 10 % of initial value

tan



Less than specified value

LOW TEMPERATURE BEHAVIOR (at 120 Hz)

IMPEDANCE RATIO

(Z) T2/(Z) T1

RATED VOLTAGE (V)

T2/T1

6.3

10

162535

5063

100

- 25 °C/+ 20 °C

54

322

222

- 40 °C/+ 20 °C

10

8

6

4

3

3

3

3

Ramp-up

Ramp-down

T

T

t

s

Preheat

Critical Zone

t 25 °C to Peak

Time