ADM660/ADM8660

REV. C

–11–

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADM660ANZ

−40°C to +85°C

8-Lead Plastic Dual In-Line Package [PDIP]

N-8

ADM660ARZ

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

ADM660ARZ-REEL

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

ADM660ARUZ

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADM660ARUZ-REEL

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADM660ARUZ-REEL7

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADM8660ANZ

−40°C to +85°C

8-Lead Plastic Dual In-Line Package [PDIP]

N-8

ADM8660ARZ

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

ADM8660ARZ-REEL

−40°C to +85°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

REVISION HISTORY

4/11—Rev. B to Rev. C

Changes to Ordering Guide .......................................................... 11

12/02—Rev. A to Rev. B

Renumbered TPCs and Figures........................................Universal

Edits to Specifications ...................................................................... 2

Updated Absolute Maximum Ratings ........................................... 3

Updated Outline Dimensions ....................................................... 10

©2011 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D00082-0-4/11(C)