OPA277P datasheet(11/26 Pages) TI

11 / 26 page

OPA277, OPA2277, OPA4277

SBOS079A

www.ti.com

DFN PACKAGE

The OPA277 series uses the 8-lead DFN (also known as

SON), which is a QFN package with contacts on only two

sides of the package bottom. This leadless, near-chip-scale

package maximizes board space and enhances thermal and

electrical characteristics through an exposed pad.

DFN packages are physically small, have a smaller routing

area, improved thermal performance, and improved electrical

parasitics, with a pinout scheme that is consistent with other

commonly-used packages, such as SO and MSOP. Addition-

ally, the absence of external leads eliminates bent-lead

issues.

The DFN package can be easily mounted using standard

printed circuit board (PCB) assembly techniques. See Appli-

cation Note,

QFN/SON PCB Attachment (SLUA271) and

Application Report,

Quad Flatpack No-Lead Logic Packages

(SCBA017), both available for download at www.ti.com.

The exposed leadframe die pad on the bottom of the

package should be connected to V–.

LAYOUT GUIDELINES

The leadframe die pad should be soldered to a thermal pad

on the PCB. Mechanical drawings located at the end of this

data sheet list the physical dimensions for the package and

pad.

Soldering the exposed pad significantly improves board-level

reliability during temperature cycling, key push, package

shear, and similar board-level tests. Even with applications

that have low-power dissipation, the exposed pad must be

soldered to the PCB to provide structural integrity and long-

term reliability.

OPA277P Datasheet(PDF) 11 Page - Texas Instruments