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HT24LC02A Datasheet(PDF) 10 Page - Holtek Semiconductor Inc |
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HT24LC02A Datasheet(HTML) 10 Page - Holtek Semiconductor Inc |
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10 / 11 page ![]() Carrier Tape Dimensions SOP 8N Symbol Description Dimensions in mm W Carrier Tape Width 12.0 +0.3/-0.1 P Cavity Pitch 8.0 ±0.1 E Perforation Position 1.75 ±0.1 F Cavity to Perforation (Width Direction) 5.5 ±0.1 D Perforation Diameter 1.55 ±0.10 D1 Cavity Hole Diameter 1.50+0.25 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.0 ±0.1 A0 Cavity Length 6.4 ±0.1 B0 Cavity Width 5.2 ±0.1 K0 Cavity Depth 2.1 ±0.1 t Carrier Tape Thickness 0.30 ±0.05 C Cover Tape Width 9.3 ±0.1 SOT23-5 Symbol Description Dimensions in mm W Carrier Tape Width 8.0 ±0.3 P Cavity Pitch 4.0 ±0.1 E Perforation Position 1.75 ±0.10 F Cavity to Perforation (Width Direction) 3.50 ±0.05 D Perforation Diameter 1.5 +0.1/-0.0 D1 Cavity Hole Diameter 1.5 +0.1/-0.0 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.00 ±0.05 A0 Cavity Length 3.15 ±0.10 B0 Cavity Width 3.2 ±0.1 K0 Cavity Depth 1.4 ±0.1 t Carrier Tape Thickness 0.20 ±0.03 C Cover Tape Width 5.3 ±0.1 HT24LC02A Rev. 1.00 10 January 29, 2013 P D 1 W P 1 P 0 D E F t K 0 B 0 A 0 C I C p a c k a g e p i n 1 a n d t h e r e e l h o l e s a r e l o c a t e d o n t h e s a m e s i d e . R e e l H o l e |
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