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TS922AIYST Datasheet(PDF) 16 Page - STMicroelectronics |
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TS922AIYST Datasheet(HTML) 16 Page - STMicroelectronics |
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16 / 24 page ![]() Package information TS922, TS922A 16/24 DocID5150 Rev 11 5.1 8-bump Flip-chip package information Figure 14. 8-bump Flip-chip package dimensions (top view) 1. Die size: 1600 μm x 1600 μm ±30 μm Die height: 350 µm ±20 µm Die height (including bumps): 650 µm Bump diameter: 315 µm ±50 µm Bump height: 250 µm ±40 µm Pitch: 500 µm ±10 µm Backcoating Figure 15. 8-bump Flip-chip footprint recommendation |
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