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MCP6061 Datasheet(PDF) 21 Page - Microchip Technology |
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MCP6061 Datasheet(HTML) 21 Page - Microchip Technology |
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21 / 40 page ![]() © 2010 Microchip Technology Inc. DS22189B-page 21 MCP6061/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC (150 mil) (MCP6061, MCP6062) Example: XXXXXXXX XXXXYYWW NNN MCP6061E SN^^ 1044 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e Example: AHC 044 25 8-Lead 2x3 TDFN (MCP6061, MCP6062) XXX YWW NN 5-Lead SOT-23 (MCP6061) XXNN Example: YG25 |
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