82563EB/82564EB Gigabit Platform LAN

Connect

Networking Silicon

Datasheet

Product Features

■

IEEE 802.3ab compliant

— Robust operation over the installed base of

Category-5 (Cat-5) twisted pair cabling

■

PICMG 3.1 compliant

— Robust operation in backplane over

Ethernet applications.

■

Support for cable line lengths greater than

100 m (spec); 123 m physical

— Robust end to end connections over

various cable lengths

■

Full duplex at 10, 100, or 1000 Mb/s and half

duplex at 10 or 100 Mb/s.

■

IEEE 802.3ab Auto-negotiation with Next

Page support

— Automatic link configuration including

speed, duplex, and flow control

■

10/100 downshift

— Automatic link speed adjustment with

poor quality cable

■

Automatic MDI crossover

— Helps to correct for infrastructure issues

■

Advanced Cable Diagnostics

— Improved end-user troubleshooting

■

Kumeran interface

— Low pin count, high speed interface to the

Intel® 631xESB/632xESB I/O Controller

Hub

— Allows PHY placement proximity to I/O

back panel.

■

7 LED outputs per port (4 configurable plus 3

dedicated)

— Link and Activity indications (10, 100,

1000 Mb/s) on each port

■

Clock supplied to the 631xESB/632xESB

— Cost optimized design

■

Full chip power down

— Support for lowest power state

■

100 pin TQFP Package

— Smaller footprint and lower power

dissipation compared to multi-chip MAC

and PHY solutions

■

Operating temperature: 0°C to 60° C

(maximum) – heat sink or forced airflow not

required

— Simple thermal design

■

Power Consumption: < 1.0 Watts per port

(silicon power)

— Minimize impact of incorporating dual

Gigabit instead of Fast Ethernet

■

Leaded and lead-free

Exposed-Pad*. Devices that are lead-free are

marked with a circled “e3” and have a

product code: HYXXXXX

a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm.

The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazard-

ous Substances (RoHS) -banned materials, is available at:

ftp://download.intel.com/design/packtech/material_content_IC_Pack

In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device.

For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative.

316534-004

Revision 2.9