SE30AFB thru SE30AFJ

www.vishay.com

Vishay General Semiconductor

Revision: 17-Aug-12

4

Document Number: 89955

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

0

20

40

60

80

100

120

140

0.0

2.0

4.0

6.0

8.0

10.0

Scu (cm2)

Epoxy printed

circiut board FR4

copper

thickness = 70 μm

DO-221AC (SlimSMA)

Cathode Band

0.106 (2.70)

0.098 (2.50)

0.047 (1.20)

0.030 (0.75)

0.047 (1.20)

MIN.

0.047 (1.20)

MIN.

0.123 (3.12) MAX.

0.217 (5.52) REF.

0.060 (1.52)

MIN.

0.057 (1.45)

0.049 (1.25)

0.039 (1.00)

0.035 (0.90)

0.012 (0.30)

0.006 (0.15)

0.171 (4.35)

0.163 (4.15)

0.211 (5.35)

0.199 (5.05)

Typ.: 0.019 (0.48)

Mounting Pad Layout