LM337HSLASHNOPB datasheet(8/22 Pages) TI1

8 / 22 page

LM137, LM337-N

SNVS778D – MAY 1999 – REVISED APRIL 2013

www.ti.com

APPLICATION HINTS

When a value for

θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is

less than or equal to this number.

HEATSINKING SOT-223 PACKAGE PARTS

The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize

the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a

θ(J−A) of 75°C/W for

1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.

Figure 9.

θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package

Figure 10. Maximum Power Dissipation vs. TAMB for the SOT-223 Package

Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT-

223 package.

Submit Documentation Feedback

Product Folder Links: LM137 LM337-N

LM337H/NOPB Datasheet(PDF) 8 Page - Texas Instruments