BAT54_SER

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 5 — 5 October 2012

7 of 11

NXP Semiconductors

BAT54 series

Schottky barrier diodes

11. Soldering

Fig 6.

Reflow soldering footprint SOT23 (TO-236AB)

Fig 7.

Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3

×)

0.6

(3

×)

0.6

(3

×)

0.7

(3

×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2

×)

1.2

(2

×)

2.2

2.6

Dimensions in mm