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AXN500045G Datasheet(PDF) 2 Page - Panasonic Semiconductor |
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AXN500045G Datasheet(HTML) 2 Page - Panasonic Semiconductor |
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2 / 7 page ![]() Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e AXN(5/6) ACCTB18E 201201-T PRODUCT TYPES Note) Connectors are available in a standard embossed tape package (1,000 pcs/lot). Minimum ordering quantity is a single reel. Samples for mounting confirmation: Available in units of 50 pieces. Please consult us. (See “Regarding sample orders to confirm proper mounting” on page 170.) Samples: Small lot orders for the above models are possible. SPECIFICATIONS 1. Characteristics 2. Material and surface treatment DIMENSIONS (Unit: mm) Mated height No. of pins Part No. Packing quantity Socket Header Inner carton (1 reel) Outer carton 5.0 mm 20 AXN520045G AXN620585G 1,000 pcs. 2,000 pcs. 30 AXN530045G AXN630585G 40 AXN540045G AXN640585G 50 AXN550045G AXN650585G 60 AXN560045G AXN660585G 80 AXN580045G AXN680585G 100 AXN500045G AXN600585G Item Specifications Conditions Electrical characteristics Rated current 0.2A Rated voltage 60V AC/DC Breakdown voltage 150V AC for 1 min. Detection current: 1mA Insulation resistance Min. 1000M Ω Using 500V DC megger Contact resistance Max. 80m Ω Based on the contact resistance measurement method specified by JIS C 5402. Mechanical characteristics Composite insertion force Max. 0.981N {100gf} × no. of pins (initial) Composite removal force Min. 0.0785N {8gf} × no. of pins Contact holding force Min. 2.94N {300gf}/2 pin contacts Measuring the maximum force. As the contact is axially pull out. Environmental characteristics Ambient temperature –55 °C to +85°C No freezing at low temperatures Soldering heat resistance Max. peak temperature of 245 °C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 °C within 5 seconds Soldering iron Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100M Ω, contact resistance max. 80m Ω Sequence 1. –55 °C, 30 minutes 2. ~ , Max. 5 minutes 3. 85 °C, 30 minutes 4. ~ , Max. 5 minutes Humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100M Ω, contact resistance max. 80m Ω Bath temperature 40 ±2°C, humidity 90 to 95% R.H. Saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100M Ω, contact resistance max. 80m Ω Bath temperature 35 ±2°C, saltwarter concentration 5±1% H2S resistance (header and socket mated) 48 hours, contact resistance max. 80m Ω Bath temperature 40 ±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. SO2 resistance (header and socket mated) 48 hours, contact resistance max. 80m Ω Bath temperature 40 ±2°C, gas concentration 10±3 ppm, humidity 90 to 95% R.H. Lifetime characteristics Insertion and removal life 20 times Repeated insertion and removal speed of max. 200 times/hours Unit weight 30 pin contacts; Socket: 0.19g Header: 0.32g 50 pin contacts; Socket: 0.29g Header: 0.50g Part name Material Surface treatment Molded portion Heat-resistant resin (UL94V-0) — Contact/post Copper alloy Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) 0 –3 +3 0 • Socket Dimension table (mm) No. of pins A B 20 7.40 4.50 30 9.90 7.00 40 12.40 9.50 50 14.90 12.00 60 17.40 14.50 80 22.40 19.50 100 27.40 24.50 A B ±0.1 1.02 3.05 0.50 ±0.05 0.50 ±0.05 0.20 ±0.03 Contact 60 0.10 Contact 60 0.12 General tolerance: ±0.2 Recommended PC board pattern (TOP VIEW) B ±0.05 0.50 ±0.05 0.50 ±0.05 0.25 ±0.05 0.75 ±0.05 0.125 ±0.05 |
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