BA4580RF datasheet(44/49 Pages) ROHM

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Technical Note

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BA4558F,BA4558R F/FV/FVM,BA4560F,BA4560RF/FV/FVM,BA4564RFVBA4580RF/FVM,BA4584FV,

BA4584RF/FV,BA8522RF/FV/FVM,BA15218F,BA14741F,BA15532F,BA4510F/FV,BA2115F/FVM

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2011.08 - Rev.B

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Notes for use

1) Processing of unused circuit

It is recommended to apply connection (see the Fig.321) and set the non inverting

input terminal at the potential within input common-mode voltage range (Vicm), for

any unused circuit.

2) Input voltage

Applying VEE~VEE+36[V] (BA4580R, BA4584, BA4584R family), VEE+14[V]

(BA2115 family) (VEE - 0.3) ~ (VEE + 36)[V]

( BA4558R, BA4560R, 4564R, BA8522R)to the input terminal is possible without

causing deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage is within

the common mode input voltage range of the electric characteristics.

3) Maximum output voltage

Because the output voltage range becomes narrow as the output current

Increases, design the application with margin by considering changes in electrical

characteristics and temperature characteristics.

4) Short-circuit of output terminal

When output terminal and VCC or VEE terminal are shorted, excessive Output

current may flow under some conditions, and heating may destroy IC. It is

necessary to connect a resistor as shown in Fig.322, thereby protecting against

load shorting.

5) Power supply (split supply / single supply) in used

Op-amp operates when specified voltage is applied between VCC and VEE.

Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well.

6) Power dissipation (Pd)

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

7) Short-circuit between pins and wrong mounting

Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other

components on the circuits, can damage the IC.

8) Use in strong electromagnetic field

Using the ICs in strong electromagnetic field can cause operation malfunction.

9) Radiation

This IC is not designed to be radiation-resistant.

10) Handing of IC

When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezoelectric

(piezo) effect.

11) Inspection on set board

During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the

board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can stress

the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.

12) Output capacitor

When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor,

connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the

circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC

for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a voltage

comparator. Set the capacitor connected to output terminal below 0.1[μF] in order to prevent damage to IC.

VEE

VCC

VEE

Connect

to Vicm

protection

resistor

application circuit for unused op-amp

Fig. 321 The example of

Fig. 322 The example of

output short protection

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