2002 Feb 27

6

NXP Semiconductors

Product data sheet

Voltage regulator diodes

BZX79 series

THERMAL CHARACTERISTICS

Note

1.

Device mounted on a printed circuit-board without metallization pad.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point lead length 8 mm.

300

K/W

thermal resistance from junction to ambient lead length max.; see Fig.2 and note 1

380

K/W

GRAPHICAL DATA

handbook, full pagewidth

110

MBG930

10

1

tp (ms)

tp

tp

T

T

0.02

0.01

≤0.001

0.75

0.50

0.33

0.20

0.10

0.05

δ = 1

Rth j-a

(K/W)

Fig.2 Thermal resistance from junction to ambient as a function of pulse duration.